Sn/Cu接头界面金属间化合物层的生长及强磁场的影响

来源期刊：中国有色金属学报2008年第3期

论文作者：程从前 赵杰 徐洋 许富民 杨朋

文章页码：449 - 449

关键词：Sn/Cu；金属间化合物层；时效；强磁场；

Key words：Sn/Cu; intermetallic compound layers; aging; high magnetic field

摘    要：

Abstract: The growth behaviors of interfacial intermetallic compound (IMC) layers in soldered and diffusion bonding Sn/Cu joints during aging and the effect of high magnetic field were investigated. The results show that the cross sections and morphologies of IMC layers in soldered and diffusion-bonding joints before aging are different. The growth behaviors of these two IMC layers are similar when these joints are aged without magnetic field. The growth activation energies for the two IMC layers are 116 and 94 kJ/mol, respectively. In order to study the effect of high magnetic field on the growth behavior of IMC layers, the samples were aged at 190℃ in 8 T of high magnetic field strength. The results show that there exit unobvious difference between the growth kinetics of IMC layers in the two joints. However, the morphologies and orientations of IMC layers in these two joints change by high magnetic field.

基金信息：国家自然科学基金资助项目
“十一五”国家科技支撑计划资助项目
国家自然科学基金广东省联合基金重点资助项目