Parameter fitting of constitutive model and FEM analysis ofsolder joint thermal cycle reliability for lead-free solder Sn-3.5Ag
来源期刊：中南大学学报(英文版)2009年第3期
论文作者：周萍 胡炳亭 周孑民 杨莺
文章页码：339 - 343
Key words：lead free solder; Sn-3.5Ag alloy; Sn-37Pb alloy; constitutive model; tensile; FEM analysis; thermal cycle reliability
Abstract: The experimental tests of tensile for lead-free solder Sn-3.5Ag were performed for the general work temperatures range from 11 to 90 ℃ and strain rate range from 5×10-5 to 2×10-2 s-1, and its stress—strain curves were compared to those of solder Sn-37Pb. The parameters in Anand model for solder Sn-3.5Ag were fitted based on experimental data and nonlinear fitting method, and its validity was checked by means of experimental data. Furthermore, the Anand model was used in the FEM analysis to evaluate solder joint thermal cycle reliability. The results show that solder Sn-3.5Ag has a better creep resistance than solder Sn-37Pb. The maximum stress is located at the upper right corner of the outmost solder joint from the symmetric center, and thermal fatigue life is predicted to be 3.796×104 cycles under the calculated conditions.
基金信息：the National Natural Science Foundation of China
