Effects of Ti addition on microstructures of melt-spun CuCr ribbons
来源期刊：中国有色金属学报(英文版)2007年第1期
论文作者：王宥宏 宋晓平 孙占波 周轩 郭娟
文章页码：72 - 72
Key words：CuCr alloys; melt spinning; thermodynamic; contact; resistivity
Abstract: The microstructure and resistivity of melt-spun CuCrTi ribbon were studied. The results reveal that the maximal size of the primary Cr particles in the microstructures is below 100 nm by 0.65%-3.8%Ti (mole fraction) addition and the resistivity of annealed ribbons of 0.65%-1.3%Ti addition can meet the need of the contact materials used by the medium-voltage vacuum interrupters. By contrasting the melt-spun microstructures to the annealed microstructures, the primary Cr particles do not grow up quickly in the annealing process. The X-ray diffraction studies reveal that alloying increases the amount of the solute in Cu and Cr phases and results in the increase of resistivity. By the thermodynamic analysis, adding Ti to CuCr29 alloys increases the critical supercooling of the liquid/solid transformation, which makes the critical radius of nucleation decrease and the rate of nucleation increase. As a result, the microstructure of CuCr ribbon can be further refined.
基金信息：the National Natural Science Foundation of China
