Creep behavior of SnAgCu solders with rare earth Ce doping

来源期刊：中国有色金属学报(英文版)2010年第3期

论文作者：张亮 薛松柏 皋利利 曾广 陈燕 禹胜林 盛重

文章页码：412 - 417

Key words：rare earth Ce; SnAgCu solder; creep behavior; constitutive equations

Abstract: Extensive testing was carried out to study the effects of rare earth Ce doping on the properties of SnAgCu solder alloys. The addition of 0.03% (mass fraction) rare earth Ce into SnAgCu solder may improve its mechanical properties, but slightly lower its melting temperature. The tensile creep behavior of bulk SnAgCuCe solders was reported and compared with SnAgCu solders. It is found that SnAgCuCe solders show higher creep resistance than SnAgCu alloys. Moreover, Dorn model and Garofalo model are successfully used to describe the creep behavior of SnAgCu and SnAgCuCe alloys. The parameters of the two creep constitutive equations for SnAgCu and SnAgCuCe solders are determined from separated constitutive relations and experimental results. Nonlinear least-squares fitting is selected to determine the model constants. The experimental data of the stress—creep strain rate curves are in good agreement with the theoretical ones.

基金信息：Doctoral Dissertation Innovation and Excellence Producing Foundation of Nanjing University of Aeronautics and Astronautics, China
the Jiangsu General Colleges and Universities Postgraduate Scientific Research Innovative Plan, China