Evolution of microstructure and dimension of as-molded parts during thermal removal process of wax-based MIM binder
来源期刊:中国有色金属学报(英文版)2001年第3期
论文作者:李益民 黄伯云 李松林 曾舟山 曲选辉
文章页码:340 - 344
Key words:binder; as-molded parts; microstructure; dimension
Abstract: The evolution of the microstructure and the dimension of as-molded parts were studied on the basis of the thermogravimetric analysis of wax-based MIM binder. The results show that the binder removal speeds are different in different temperature ranges during binder removal process. The evolution of the microstructure of as-molded parts during binder removal process clearly showed the initiation and formation of connected pore structure, which is the removal channel of the binder. The as-molded parts almost continuously shrank through binder removal process, except an expansion stage during 320~440 ℃, which is the dissolution expansion effect due to the dissolution of VPW in the polymer melt.