半导体激光软钎焊Sn-Ag-Cu焊点微观组织

来源期刊：中南大学学报(自然科学版)2006年第2期

论文作者：韩宗杰 鞠金龙 薛松柏 方典松 王俭辛 姚立华

文章页码：229 - 234

关键词：半导体激光软钎焊;无铅钎料; Sn-Ag-Cu;微观组织

Key words：diode-laser soldering; lead-free solder; Sn-Ag-Cu; microstructure

摘    要：采用90 W半导体激光焊接系统对Sn-Ag-Cu无铅钎料在纯铜基板上进行钎焊试验。针对在不同激光输出功率下形成的微焊点形貌,分析Sn-Ag-Cu钎料在纯铜基板上的润湿、铺展规律和微焊点的微观组织特征。通过分析比较在激光软钎焊和红外再流焊2种再流焊加热方式的Sn-Ag-Cu钎料微焊点的微观组织,发现:当采用半导体激光软钎焊时存在最佳输出功率,在此功率下得到的微焊点组织均匀,晶粒细小,没有产生空洞缺陷,力学性能最佳。

Abstract: Soldering experiment with Sn-Ag-Cu lead-free solder was carried out on pure Cu substrate using 90 W diode-laser soldering system. The regulations of the wetting and spreadability properties of Sn-Ag-Cu lead-free solder on pure Cu substrate with different laser output powers and the characteristics of microstructures of micro-joints were studied. Compared with microstructures of micro-joints soldered with Sn-Ag-Cu lead-free solder by means of diode-laser soldering system and infrared reflow soldering system, it is found that there is an optimum laser power value on the tensile strength of micro-joints soldered with diode-laser soldering system.The microstructures of the joints soldered with the optimum laser power value are homogeneous.The crystal grains of joints are fine, and no defect exists in the joints. The mechanical properties of the soldered joints with the laser power value of diode-laser output are the best.