Influences of sub-micrometer Ta and Co dopants onmicrostructure and properties of tungsten heavy alloys^①

来源期刊：中国有色金属学报(英文版)2004年第4期

论文作者：谭兴龙 冷邦义 邱绍宇 李强 何文艳 王传海 雷代富

文章页码：747 - 750

Key words：tungsten heavy alloys; sub-micrometer; Co powder; Ta powder; cleavage fracture

Abstract: Tungsten heavy alloys are aggregates of particles of tungsten bonded with Ni/Fe or Ni/Cu via liquid-phasesintering. The sub-micrometer Ta Co powder was added to this aggregate to strengthen the bonding phase. It is found that the main fracture pattern of the alloys is cleavage of tungsten grains and ductile rupture of bond phase, leading to improved tensile strength and elongation. Dopant Ta can act as grain size inhibitor in tungsten heavy alloys.