Features of machine variables in thermosonic flip-chip-有色金属在线

简介概要

Features of machine variables in thermosonic flip-chip

图书来源：微电子制造先进封装进展

作者：韩雷李军辉王福亮

出版时间：2012-12 定价：115元

图书ISBN：978-7-5487-0709-7

出版单位：中南大学出版社

详情信息展示

Features of machine variables in thermosonic flip-chip

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相关知识点

Power and interface features of thermosonic flip-chip bonding

Dynamics of ultrasonic transducer system for thermosonic flip-chip bonding

Interface mechanism of ultrasonic flip-chip bonding

Ultrasonic vibration at thermosonic flip-chip bonding interface

Modeling study of thermosonic flip-chip bonding process

Stress-induced atom diffusion at thermosonic flip-chip bonding interface

Effects of ultrasonic power and time on bonding strength and interfacial atomic diffusion during thermosonic flip-chip bonding

The law of ultrasonic energy conversion in thermosonic flip-chip bonding interfaces

Experimental observations on nonlinearphenomena in transducer assembly forthermosonic flip-chip bonding

Short-circuit diffusion of ultrasonic bonding interfaces in microelectronic packaging

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