Numerical solution to T-φS-CL coupling in binary dendrite solidification with any solid-back diffusion effects
来源期刊：中国有色金属学报(英文版)2003年第5期
论文作者：徐达鸣 郭景杰 傅恒志 苏彦庆 李庆春
文章页码：1149 - 1154
Key words：alloy solidification; coupled transport phenomena; solid-back diffusion; numerical modeling
Abstract: A previous numerical solution method to the strong nonlinear T-φS-CL coupling for a Scheil-type binary solidification process was extended and modified for single-phase dendrite solidifications of any nominal alloy composition(in a composition range of single-phase or eutectic solidification) and with any solid-back diffusion extents. Numerical sample computations were performed on Al-Cu system with different nominal compositions from almost pure Al to nearly eutectic and with different solid diffusion coefficients, which are factitiously enlarged or decreased in eight orders of magnitude. The calculation results exhibit the feasibility, capability and efficiency of the proposed numerical scheme in modeling an arbitrary binary dendrite solidification problem.
