Research on Processes and Adhesion of Electroless Plating Ni-Cu-P Coating
来源期刊：材料保护2004年增刊第2期
论文作者：LIU Bo LIU De-gang HUANG Yan-bin XU Xiao-li ZHANG Ping
关键词：electroless plating; Ni-Cu-P; adhesion; depositing technique; corrosion resistance;
摘 要：In order to improve the corrosion and wear resistance of the coatings of electroless plating Ni-Cu-P and broaden its application, an optimizing mathematical theory test has been applied in this research. The processing parameters have been optimized and some Ni-Cu-P coatings have been obtained with smooth and glittering appearance. At the same time,the composite complexants can prevent copper from depositing first and obtain coatings with strong adhesion. The porosity of Ni-Cu-P coating (20 μm) ranked class 9. The changing color time of the coating is more than 800 seconds with HNO3 dropthan 0.5 g/L. The surface appearance of deposition is typical cystiform cells by SEM,which rank close and neatly.
LIU Bo1，LIU De-gang1，HUANG Yan-bin1，XU Xiao-li1，ZHANG Ping1
(1.Department of Material Science and Engineering, Academy of Armored Force Engineering, Beijing 100072)
摘要:In order to improve the corrosion and wear resistance of the coatings of electroless plating Ni-Cu-P and broaden its application, an optimizing mathematical theory test has been applied in this research. The processing parameters have been optimized and some Ni-Cu-P coatings have been obtained with smooth and glittering appearance. At the same time,the composite complexants can prevent copper from depositing first and obtain coatings with strong adhesion. The porosity of Ni-Cu-P coating (20 μm) ranked class 9. The changing color time of the coating is more than 800 seconds with HNO3 dropthan 0.5 g/L. The surface appearance of deposition is typical cystiform cells by SEM,which rank close and neatly.
关键词:electroless plating; Ni-Cu-P; adhesion; depositing technique; corrosion resistance;
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