Improvement of Bonding Strength of Horizontal Twin-Roll Cast Steel/Aluminum Clad Sheet by Electromagnetic Fields
来源期刊:Acta Metallurgica Sinica2018年第1期
论文作者:Gang Chen Jin-Tao Li Guang-Ming Xu
文章页码:55 - 62
摘 要:Electromagnetic field is an available online method to increase bonding strength of clad sheet manufactured by horizontal twin-roll casting(HTRC). In this paper, an electric current pulse(ECP) and a complex field(static magnetic field(SMF) together with ECP) are exerted during HTRC of steel/aluminum clad sheet. The produced clad sheet has good appearance, and no visible defects exist at the bonding interface. The inter-diffusion zone at Fe/Al interface in ECP and SMF+ECP sheets is 3 and 4 lm, respectively, and the latter increases slightly compared with that in non-field sheet. The average peel strengths(APS) of ECP and SMF+ECP sheet are 14 and 21 N/mm, respectively, which increase by 2 and9 N/mm compared with 12 N/mm of non-field sheet. The APS increment in SMF+ECP sheet is resulted from the increment of interface bonding spots and the enhancement of inter-diffusion zone width.
Gang Chen1,Jin-Tao Li1,2,Guang-Ming Xu1
1. Key Laboratory of Electromagnetic Processing of Materials(Ministry of Education), Northeastern University2. School of Mechanical, Materials and Mechatronic Engineering, University of Wollongong
摘 要:Electromagnetic field is an available online method to increase bonding strength of clad sheet manufactured by horizontal twin-roll casting(HTRC). In this paper, an electric current pulse(ECP) and a complex field(static magnetic field(SMF) together with ECP) are exerted during HTRC of steel/aluminum clad sheet. The produced clad sheet has good appearance, and no visible defects exist at the bonding interface. The inter-diffusion zone at Fe/Al interface in ECP and SMF+ECP sheets is 3 and 4 lm, respectively, and the latter increases slightly compared with that in non-field sheet. The average peel strengths(APS) of ECP and SMF+ECP sheet are 14 and 21 N/mm, respectively, which increase by 2 and9 N/mm compared with 12 N/mm of non-field sheet. The APS increment in SMF+ECP sheet is resulted from the increment of interface bonding spots and the enhancement of inter-diffusion zone width.
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