LOW TEMPERATURE THERMAL DEBINDING BEHAVIOR OF WAX-BASED MULTI-COMPONENT BINDER FOR TUNGSTEN HEAVY ALLOY

来源期刊：中国有色金属学报(英文版)1999年第1期

论文作者：Fan Jinglian Huang Baiyun Qu Xuanhui Li Yiming

文章页码：93 - 99

Key words：thermal debinding;　multi-component binder;　tungsten;　heavy alloy

Abstract: To control the defects in thermal debinding stage, low temperature thermal debinding behavior of wax in the multi-component binder for tungsten heavy alloy was studied. The wax burnout temperature is below 250℃, at which the defects mainly occur. The debinding rate is controlled by the diffusion of wax in the polymer to the inner surface of pores and then to the external environment. The experiment proved the amount of removed wax as an exponential function of time, the reciprocal sample thickness and temperature coeffcient.