Sn-3.5Ag-0.5Cu在高体积分数SiCp/Al复合材料Ni-P(-SiC)镀层上的润湿性

来源期刊:中国有色金属学报(英文版)2018年第9期

论文作者:张相召 吴晓浪 刘桂武 骆文强 郭亚杰 邵海成 乔冠军

文章页码:1784 - 1792

关键词:Ni 镀层;Sn-Ag-Cu 合金;SiCp/Al复合材料;润湿;显微结构;界面

Key words:Ni coating; Sn-Ag-Cu alloy; SiCp/Al composite; wetting; microstructures; interface

摘    要:基于化学镀Ni工艺,研究Sn-3.5Ag-0.5Cu合金在Ni-P(-SiC)镀层/SiCp/Al基体上的润湿行为,分析镀层的显微结构和Sn-3.5Ag-0.5Cu/Ni-P(-SiC)镀层/SiCp/Al体系的润湿和界面行为。结果表明,SiC颗粒均匀地分布在镀层中,且Ni-P(-SiC)镀层与SiCp/Al复合材料之间没有界面反应。Sn-3.5Ag-0.5Cu对Ni-P、Ni-P-3SiC、Ni-P-6SiC和Ni-P-9SiC镀层/SiCp/Al基体对应的最终接触角分别为~19°、29°、43°和113°。在Sn-3.5Ag- 0.5Cu/Ni-P-(0,3,6)SiC镀层/SiCp/Al界面处形成含有Cu、Ni、Sn 和 P的反应层,其主要包含Cu-Ni-Sn和 Ni-Sn-P相。此外,熔融的Sn-Ag-Cu合金可以通过Ni-P/SiC界面渗入Ni-P(-SiC)复合镀层与SiCp/Al基体接触。

Abstract: The wetting of molten Sn-3.5Ag-0.5Cu alloy on the Ni-P(-SiC) coated SiCp/Al substrates was investigated by electroless Ni plating process, and the microstructures of the coating and the interfacial behavior of wetting systems were analyzed. The SiC particles are evenly distributed in the coating and enveloped with Ni. No reaction layer is observed at the coating/SiCp/Al composite interfaces. The contact angle increases from ~19° with the Ni-P coating to 29°, 43° and 113° with the corresponding Ni-P-3SiC, Ni-P-6SiC and Ni-P-9SiC coatings, respectively. An interaction layer containing Cu, Ni, Sn and P forms at the Sn-Ag-Cu/Ni-P-(0,3,6)SiC coated SiCp/Al interfaces, and the Cu-Ni-Sn and Ni-Sn-P phases are detected in the interaction layer. Moreover, the molten Sn-Ag-Cu can penetrate into the Ni-P(-SiC) coatings through the Ni-P/SiC interface and dissolve them to contact the SiCp/Al substrate.

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