Preparation and Properties of Particle Reinforced Sn-Zn-based Composite Solder
来源期刊：Journal Of Wuhan University Of Technology Materials Science Edition2009年第2期
论文作者：黄惠珍
文章页码：206 - 209
摘 要：Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ Cu5Zn8 particles are formed and distributed uniformly in the composite solders. The strength and plasticity of the composite solders were improved, and creep resistance was considerably enhanced. The wettability of these composite solders is also better than that of Sn-9Zn.
黄惠珍
School of Materials Science and Engineering, Nanchang University
摘 要：Particle reinforced Sn-Zn based composite solders were obtained by adding Cu powders to Sn-9Zn melts. The microstructure analysis reveals that in situ Cu5Zn8 particles are formed and distributed uniformly in the composite solders. The strength and plasticity of the composite solders were improved, and creep resistance was considerably enhanced. The wettability of these composite solders is also better than that of Sn-9Zn.
关键词：
