TB2/Cu/TB2扩散焊的界面反应
来源期刊：中国有色金属学报2000年第1期
论文作者：张凯锋 吴为
文章页码：17 - 21
关键词：钛合金；铜箔；扩散焊；界面
Key words：titanium alloys; copper foils; diffusion welding; interface
摘 要：通过OM，SEM，XRD，EDS，EPMA等分析测试手段，对采用Cu箔作中间夹层的TB2扩散焊界面组织、反应相生成及其生长规律进行了分析。依照Cu-Ti二元相图，选择扩散焊温度分别为1123 K, 1173 K和压 力为5MPa，经30，60，120min扩散焊后，Cu与Ti分别生成Cu3Ti2，CuTi，CuTi3，这三者都硬而脆，尤其是CuTi3的生成使界面的剪切性能严重恶化。
Abstract: The interfacial microstructure, the growth of reaction phases and the growth regularities of TB2 diffusion welding were analyzed by OM, SEM, XRD, EDS and EPMA, when Cu foil was employed as the sandwiched layer between two TB2 specimens. According to the binary phase diagram of Cu-Ti,the temperatures of diffusion welding were selected as 1123 and 1173 K, respectively. After diffusion welding for 30, 60 and 120 min with the diffusion welding pressure being 5 MPa, Cu and Ti reacted to form Cu3Ti2,CuTi and CuTi3, respectively, all of which are hard and brittle, especially CuTi3 makes the shear property of interface substantially degrade.
