EFFECT OF RESIDUAL STRESS ON THE MARTENSITIC TRANS- FORMATION OF SPUTTER-DEPOSITED SMA THIN FILMS
来源期刊：Acta Metallurgica Sinica2002年第4期
论文作者：D.Xu B.C.Cai L.Wang
Key words：martensitic transformation; residual stress; TiNi; thin film; shape memory alloy;
Abstract: TiNi thin films were sputter-deposited on circular single-crystal silicon substrates un-der various sputtering parameters. The crystal structure and residual stress of the as-deposited films were determined by X-ray diffraction and substrate-curvature method.The phenomenon of stress-suppressed martensitic transformation was observed. It isconsidered that the residual stresses in SMA thin films based on circular substratesact as balanced biaxial tensile stresses. The status of equilibrant delays the align-ment of self-accommodated variants and the volume shrinkage during the martensitictransformation.
D.Xu1，B.C.Cai1，L.Wang1
(1.Information Storage Research Center, Shanghai Jiao Tong University, Shanghai 200030, China)
Abstract:TiNi thin films were sputter-deposited on circular single-crystal silicon substrates un-der various sputtering parameters. The crystal structure and residual stress of the as-deposited films were determined by X-ray diffraction and substrate-curvature method.The phenomenon of stress-suppressed martensitic transformation was observed. It isconsidered that the residual stresses in SMA thin films based on circular substratesact as balanced biaxial tensile stresses. The status of equilibrant delays the align-ment of self-accommodated variants and the volume shrinkage during the martensitictransformation.
Key words:martensitic transformation; residual stress; TiNi; thin film; shape memory alloy;
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