Tungsten nanoparticle-strengthened copper composite prepared by a sol–gel method and in-situ reaction
来源期刊：International Journal of Minerals Metallurgy and Materials2019年第11期
论文作者：Tian-xing Lu Cun-guang Chen Zhi-meng Guo Pei Li Ming-xing Guo
文章页码：1477 - 1483
摘 要：Tungsten nanoparticle-strengthened Cu composites were prepared from nanopowder synthesized by a sol–gel method and in-situ hydrogen reduction. The tungsten particles in the Cu matrix were well-dispersed with an average size of approximately 100–200 nm. The addition of nanosized W particles remarkably improves the mechanical properties, while the electrical conductivity did not substantially decrease. The Cu–W composite with 6 wt% W has the most comprehensive properties with an ultimate strength of 310 MPa, yield strength of 238 MPa, hardness of HV 108 and electrical conductivity of 90% IACS. The enhanced mechanical property and only a small loss of electrical conductivity demonstrate the potential of this new strategy to prepare W nanoparticle-strengthened Cu composites.
Tian-xing Lu1，Cun-guang Chen1，Zhi-meng Guo1，Pei Li1，Ming-xing Guo2
1. Institute for Advanced Materials and Technology, University of Science and Technology Beijing2. State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing
摘 要：Tungsten nanoparticle-strengthened Cu composites were prepared from nanopowder synthesized by a sol–gel method and in-situ hydrogen reduction. The tungsten particles in the Cu matrix were well-dispersed with an average size of approximately 100–200 nm. The addition of nanosized W particles remarkably improves the mechanical properties, while the electrical conductivity did not substantially decrease. The Cu–W composite with 6 wt% W has the most comprehensive properties with an ultimate strength of 310 MPa, yield strength of 238 MPa, hardness of HV 108 and electrical conductivity of 90% IACS. The enhanced mechanical property and only a small loss of electrical conductivity demonstrate the potential of this new strategy to prepare W nanoparticle-strengthened Cu composites.
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