反应物浓度在SnAgCu纳米颗粒尺寸控制中的作用

来源期刊:中国有色金属学报(英文版)2013年第6期

论文作者:张卫鹏 赵炳戈 邹长东 翟启杰 高玉来

文章页码:1668 - 1673

关键词:化学还原法;无铅焊料;SnAgCu合金;纳米颗粒;尺寸控制;反应物浓度

Key words:chemical reduction method; lead-free solder; SnAgCu alloy; nanoparticle; size control; reactant concentration

摘    要:在电子封装领域,通过利用纳米颗粒尺寸效应带来的熔点降低,SnAgCu合金体系有希望替代传统的但有毒的SnPb焊料体系。分别选用硼氢化钠和邻啡罗琳作为还原剂和表面活性剂,采用化学还原法制备出Sn3.0Ag0.5Cu (质量分数)合金纳米粒子。对合成的纳米颗粒形貌采用场发射扫描电镜(FE-SEM)进行表征。通过对扫描电镜数据的分析,可统计出纳米颗粒的尺寸分布。研究表明,所合成的纳米颗粒尺寸随着反应物浓度的增加而增大。通过理论分析,对反应物浓度在纳米颗粒尺寸控制中的作用进行了阐述。

Abstract: Attributing to the melting temperature depressing resulted from the size effect of nanoparticles, the SnAgCu alloy system can be a promising candidate to replace the traditional toxic SnPb solder in the field of electronic packaging. Chemical reduction method was used to fabricate the Sn3.0Ag0.5Cu (SAC) (mass fraction, %) alloy nanoparticles. Sodium borohydride and 1,10-phenanthroline were chosen as the reducing agent and surfactant respectively. In addition, the morphology of the synthesized nanoparticles was investigated by field emission scanning electron microscopy (FE-SEM), and the size distribution of the as-prepared particles was obtained from the image analysis. It was found that the particle size increased with increasing the reactant concentration. Finally, theoretical analysis was employed to illustrate the influence of reactant concentration on the particle size.

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