Effect of sintering temperature on the microstructure and thermal conductivity of Al/diamond composites prepared by spark plasma sintering

Ke Chu,Cheng-chang Jia,Xue-bing Liang,and Hui Chen School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China

摘 要：<正>Spark plasma sintering was used to fabricate Al/diamond composites.The effect of sintering temperature on the microstructure and thermal conductivity（TC） of the composites was investigated with the combination of experimental results and theoretical analysis.The composite sintered at 550℃shows high relative density and strong interfacial bonding,whereas the composites sintered at lower（520CC） and higher（580-600℃） temperatures indicate no interfacial bonding and poor interfacial bonding,respectively.High relative density and strong interfacial bonding can maximize the thermal conductivity of Al/diamond composites,and taking both effects of particle shape and inhomogeneous interfacial thermal conductance into consideration can give a fairly good prediction of composites’ thermal conduction properties.

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