Wettability of SnCuNi-xEu solders and mechanical properties of solder joints
来源期刊：JOURNAL OF RARE EARTHS2014年第12期
论文作者：张亮 田磊 郭永环 孙磊 闵勇
文章页码：1184 - 1188
摘 要：Wettability balance method was used to investigate the wetting performance of Sn Cu Ni-x Eu on Cu substrate, and the mechanical properties and the fracture morphology were studied.The results indicated that the addition of Eu could enhance the properties of solder and solder joints, with the increase of Eu content, tendency of first increase and then decrease could be found in the wetting time, wetting force and the mechanical properties of Sn Cu Ni-x Eu, and the optimal content was 0.039%.For Sn Cu Ni-0.039 Eu solder joints, the optimum mechanical properties could be found, and the amplitude increased was 20%, with the observation of the fracture morphology, it was found that small dimples could be seen, the toughness fracture for Sn Cu Ni and mixture fracture for Sn Cu Ni-0.039 Eu could be demonstrated.And thermal fatigue behavior of Sn Cu Ni solder joints could be enhanced obviously with the 0.039%Eu addition.
张亮1,2，田磊3，郭永环1，孙磊1，闵勇1
1. School of Mechanical and Electrical Engineering, Jiangsu Normal University2. Department of Materials Science and Engineering,University of California at Los Angeles3. Petroleum Engineering College, Yangtze University
摘 要：Wettability balance method was used to investigate the wetting performance of Sn Cu Ni-x Eu on Cu substrate, and the mechanical properties and the fracture morphology were studied.The results indicated that the addition of Eu could enhance the properties of solder and solder joints, with the increase of Eu content, tendency of first increase and then decrease could be found in the wetting time, wetting force and the mechanical properties of Sn Cu Ni-x Eu, and the optimal content was 0.039%.For Sn Cu Ni-0.039 Eu solder joints, the optimum mechanical properties could be found, and the amplitude increased was 20%, with the observation of the fracture morphology, it was found that small dimples could be seen, the toughness fracture for Sn Cu Ni and mixture fracture for Sn Cu Ni-0.039 Eu could be demonstrated.And thermal fatigue behavior of Sn Cu Ni solder joints could be enhanced obviously with the 0.039%Eu addition.
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