Numeric simulation of thickness of intermetallic compounds in interface zone of diffusion bonding for Cu and Al

来源期刊：中国有色金属学报(英文版)2001年第6期

论文作者：李亚江 吴会强 陈茂爱 冯涛

文章页码：908 - 911

Key words：vacuum diffusion bonding; intermetallic compounds; numeric simulation

Abstract: Numeric model of intermetallic compound formation and growth in the vacuum diffusion bonding of copper and aluminum was established, and proved by EPMA and micro-hardness test etc. The numeric simulation of thickness of the intermetallic compound results in accord with the tests well. This study provides some references to determine welding parameters in the vacuum diffusion bonding of Cu/Al dissimilar materials.