一种新型低分子热塑性树脂体系CBT500/DBTL的界面张力表征

来源期刊:中南大学学报(自然科学版)2018年第10期

论文作者:吴旺青 付继先 刘毅 蒋炳炎

文章页码:2423 - 2430

关键词:原位聚合注射成型;界面张力;调和平均法;接触角法;相似理论

Key words:in-situ polymerization injection molding; interfacial tension; harmonic mean method; contact angle method; similarity theory

摘    要:为获得真实、可靠的新型低分子热塑性树脂体系CBT500(环对苯二甲酸丁二醇酯)/DBTL(二月桂酸二丁基锡)的界面张力,研究新型树脂体系的混合机理及指导混合设备研制,综合接触角法与调和平均法的各自优势,依据相似理论,提出引用调和平均法修正接触角法,首先研究20~120 ℃范围内CBT500/DBTL树脂体系的界面张力。其次采用最小二乘法分段线性拟合界面张力修正值并推广。研究结果表明:在20~120 ℃范围内,CBT500/DBTL树脂体系的界面张力随温度的升高而降低。与接触角法获得的界面张力计算值相比,采用调和平均法获得的界面张力修正值整体减小44.7%,更加接近真实值。得到20~200 ℃范围内,CBT500/DBTL树脂体系界面张力与温度之间的分段函数关系式。

Abstract: In order to obtain the real and reliable interfacial tension of a new low molecular mass thermoplastic resin system CBT500/DBTL, a new method based on the harmonic mean method corrected contact angle method was proposed to study the resin mixing mechanism and to guide the development of mixing device. Interfacial tension characterizations were conducted in the range of 20-120 ℃ for the CBT500/DBTL resin matrix system. The least squares method was used to linearly fit the corrected interfacial tension. The results show that the interfacial tension of the resin system decreases with the increase of temperature in the range of 20-120 ℃, and the corrected interfacial tension obtained by the harmonic mean method is 44.7% lower than that of the contact angle method and closer to true value. The piecewise function of the interfacial tension of the CBT500/DBTL resin system and temperature ranging from 20 to 200 ℃ is obtained.

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