Deformation characterization of conductive particles in anisotropically conductive adhesive simulated by FEM

Yanli Wang, Junpin Lin, Zhi Lin, Xinfa Cui, and Guoliang ChenState Key Laboratory for Advanced Metals & Materials, University of Science and Technology Beijing, Beijing 100083, China

摘 要：<正>The deformation behavior and the contact area of conductive particles in anisotropically conductive adhesives (ACA) were investigated by finite element method (FEM). The solid conductive particles are made of pure Ni and Cu. The results indicate that the deformation of the conductive particles is inhomogeneous during fabrication. When the reduction in height is small the deformation concentrates in the area near the contact area. As the reduction in height increases, the strain in the area near the contact area increases, and the metal flows toward the circumference, resulting in the increase of the contact area between the conductive particles and pad. The higher the degree of deformation, the larger the contact area. The regression equations were offered to express the relations between the bounding force and the contact area or the reduction in height. An approach of how to obtain the maximum contact area in ACA was discussed.

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