Heat transfer in high density electronics packaging

来源期刊：中南大学学报(英文版)2001年第4期

论文作者：ZHOU Jie-min YANG Ying DENG Sheng-xiang YI Zheng-ming WANG Xi-tao CHEN Liu Johan Liu

文章页码：278 - 282

Key words：electronics packaging; thermal reliability; heat transfer

Abstract: In order to get an insight into the thermal characteristic and to evaluate the thermal reliability of the”System in Packaging”(SIP), a new solution of electronics packaging, a heat transfer model of SIP was developed to predict the heat dissipation capacity and to investigate the effect of different factors on the temperature distribution in the electronics. The affecting parameters under consideration include the thermo physical properties of the substrates, the coefficient of convection heat transfer, the thickness of the chip, and the density of power dissipation. ALGOR, a kind of finite element analysis software ,was used to do the model simulation. Based on the simulation and analysis of the heat conduction and convection resistance, criteria for the thermal design were established and possible measurement for enhancing power dissipation was provided. The results show that the heat transfer model provides a new and effective way to the thermal design and thermal analysis of SIP and to the mechanical analysis for the further investigation of SIP.