Evolution of the microstructure and solute distribution of Sn-10wt% Bi alloys during electromagnetic field-assisted directional solidification
来源期刊：JOURNAL OF MATERIALS SCIENCE TECHNOLOG2019年第4期
论文作者：Zhe Shen Minghu Peng Dongsheng Zhu Tianxiang Zheng Yunbo Zhong Weili Ren Chuanjun Li Weidong Xuan Zhongming Ren
文章页码：568 - 577
摘 要：The effects of forced flows at different velocities on microstructure and solute distribution during the directional solidification of Sn-10 wt% Bi alloys under a simultaneous imposition of a transverse static magnetic field（TSMF） and an external direct current（DC） have been investigated experimentally and numerically. The experimental results show that the solid-liquid interface will gradually become sloping with the increase of the forced flow velocity when the thermoelectric magnetic convection（TEMC）dominates the forced flow at solidification front. However, the interface will gradually become planar as the flow velocity further increases when the electromagnetic convection（EMC） dominates the forced flow. Moreover, when the flow velocity gradually increases, the primary dendrite spacing decreases from384 to 105 μm accordingly. The simulation results show that the solute distribution at the two sides of the sample can be significantly changed by the forced flow at solidification front. The rejected solute will be unidirectionally transported to one side of the sample along the TEMC（a low-velocity forced flow）,thereby causing the formation of a sloping interface. However, the rejected solute will be returned back along the EMC（a higher-velocity force flow）, which results in a planar interface. Furthermore, the solute content at the two sides of the sample under the forced flows at different velocities was measured. The results are in good agreement with the simulation results, which shows that the solute content difference between the two sides of the sample reaches the maximum when a 0.5 T TSMF is applied, while the solute content difference decreases to zero with a simultaneous application of a 0.5 T TSMF and a 1.6 × 105 A/m2 external DC.
Zhe Shen，Minghu Peng，Dongsheng Zhu，Tianxiang Zheng，Yunbo Zhong，Weili Ren，Chuanjun Li，Weidong Xuan，Zhongming Ren
State Key Laboratory of Advanced Special Steel & Shanghai Key Laboratory of Advanced Ferrometallurgy & School of Materials Science and Engineering,Shanghai University
摘 要：The effects of forced flows at different velocities on microstructure and solute distribution during the directional solidification of Sn-10 wt% Bi alloys under a simultaneous imposition of a transverse static magnetic field（TSMF） and an external direct current（DC） have been investigated experimentally and numerically. The experimental results show that the solid-liquid interface will gradually become sloping with the increase of the forced flow velocity when the thermoelectric magnetic convection（TEMC）dominates the forced flow at solidification front. However, the interface will gradually become planar as the flow velocity further increases when the electromagnetic convection（EMC） dominates the forced flow. Moreover, when the flow velocity gradually increases, the primary dendrite spacing decreases from384 to 105 μm accordingly. The simulation results show that the solute distribution at the two sides of the sample can be significantly changed by the forced flow at solidification front. The rejected solute will be unidirectionally transported to one side of the sample along the TEMC（a low-velocity forced flow）,thereby causing the formation of a sloping interface. However, the rejected solute will be returned back along the EMC（a higher-velocity force flow）, which results in a planar interface. Furthermore, the solute content at the two sides of the sample under the forced flows at different velocities was measured. The results are in good agreement with the simulation results, which shows that the solute content difference between the two sides of the sample reaches the maximum when a 0.5 T TSMF is applied, while the solute content difference decreases to zero with a simultaneous application of a 0.5 T TSMF and a 1.6 × 105 A/m2 external DC.
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