Microstructure and thermal and electric conductivities of high dense Mo/Cu composites

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ÎÄÕÂÒ³Â룺110 - 114

Key words£ºMo/Cu composites£» microstructure£» densification£» thermal conductivity£» electric conductivity

Abstract: For electronic packaging applications, Mo/Cu composites with volume fractions of 55%, 60% and 67% Mo were fabricated by the patented squeeze-casting technology. The microstructures and thermal and electric conduction properties of the Mo/Cu composites were investigated. The results show that Mo particles are homogeneous and uniform, and the Mo-Cu interfaces are clean and free from interfacial reaction products and amorphous layers; the densifications of the Mo/Cu composites are higher than 99%. The thermal conductivities of Mo/Cu composites range from 220 to 270¤@W/(m¡¤¡æ) and decrease with an increase in volume fraction of Mo content. The thermal conductivities agree well with the predicted values of theoretical models. The electric conductivities of Mo/Cu composites are in the range of 2228¤@MS/m and decrease with the increase of Mo content. The achievement of higher thermal and electric conduction is attributed to the full densities and high purity Mo/Cu composites, which are attained through the cost-effective squeeze-casting technology processes.

»ù½ðÐÅÏ¢£ºthe Hi-tech Research and Development Program of China
the High-tech Research and Development Program of Harbin City, China