Abstract: The solvent debinding process was studied, including the relationship of binder loss with solvent composition, debinding time, sample thickness, and solvent debinding temperature and so on. The experiment shows that the multi-component low molecule solvent mixture has best results at 45 ℃. The effects of sample thickness on solvent debinding time and binder loss are dominant. With the thickness of 1 mm, the binder removal is above 70% after debinding for 4 h, while with the thickness of 10 mm, the binder removal is only 43% after debinding for 6～8 h. For the diameter of 20 mm bar, the binder loss is 50%～60% after debinding for 24～30 h, the residual binder is removed completely by thermal debinding. All experiments show that solvent debinding greatly shortens the subsequent thermal debinding time, and the large thick injected parts can be successfully debound. After solvent debinding, the parts were observed by using scanning electronic microscopy (SEM).
Investigation of solvent debinding process on tungsten heavy alloy injection parts
Abstract：
The solvent debinding process was studied, including the relationship of binder loss with solvent composition, debinding time, sample thickness, and solvent debinding temperature and so on. The experiment shows that the multi component low molecule solvent mixture has best results at 45?℃. The effects of sample thickness on solvent debinding time and binder loss are dominant. With the thickness of 1?mm, the binder removal is above 70% after debinding for 4?h, while with the thickness of 10?mm, the binder removal is only 43% after debinding for 6～8?h. For the diameter of 20?mm bar, the binder loss is 50%～60% after debinding for 24～30?h, the residual binder is removed completely by thermal debinding. All experiments show that solvent debinding greatly shortens the subsequent thermal debinding time, and the large thick injected parts can be successfully debound. After solvent debinding, the parts were observed by using scanning electronic microscopy (SEM) .
