简介概要

Electrical characteristics of MOS capacitor using amorphous Gd2O3-doped HfO2 insulator

来源期刊:Journal of Rare Earths2010年第3期

论文作者:季梅 王磊 熊玉华 杜军

文章页码:396 - 398

摘    要:This work described the electrical characteristics of a kind of amorphous Gd2O3-doped HfO2 insulator for high-k metal-oxide-semiconductor(MOS) capacitors.Compared with pure HfO2,the doped HfO2 with an optimum concentration of Gd2O3 as MOS gate dielectric exhibited a lower leakage current,thinner effective oxide thickness and less fixed oxide charges density.The result indicated that Gd2O3 doping power of 60 W exhibited the best electrical characteristics,maximum capacitance,lowest leakage current of 9.35079×10-7 A/cm2,and minimum fixed oxide charge density of 3.59×109 cm-2.The lower electronegativity and larger atomic radium of Gd contributed to the improvement in the leakage current for Gd2O3-doped HfO2 films.The electrical characteristics of Gd2O3-doped HfO2 thin film illustrated that it is a promising gate dielectric layer for future high-k gate dielectric applications.

详情信息展示

Electrical characteristics of MOS capacitor using amorphous Gd2O3-doped HfO2 insulator

季梅,王磊,熊玉华,杜军

Advanced Electronic Materials Institute,General Research Institute for Nonferrous Metals

摘 要:This work described the electrical characteristics of a kind of amorphous Gd2O3-doped HfO2 insulator for high-k metal-oxide-semiconductor(MOS) capacitors.Compared with pure HfO2,the doped HfO2 with an optimum concentration of Gd2O3 as MOS gate dielectric exhibited a lower leakage current,thinner effective oxide thickness and less fixed oxide charges density.The result indicated that Gd2O3 doping power of 60 W exhibited the best electrical characteristics,maximum capacitance,lowest leakage current of 9.35079×10-7 A/cm2,and minimum fixed oxide charge density of 3.59×109 cm-2.The lower electronegativity and larger atomic radium of Gd contributed to the improvement in the leakage current for Gd2O3-doped HfO2 films.The electrical characteristics of Gd2O3-doped HfO2 thin film illustrated that it is a promising gate dielectric layer for future high-k gate dielectric applications.

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