Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method
来源期刊：Acta Metallurgica Sinica2019年第11期
论文作者：Lin Jiang Liang Zhang A.Amali Roselin
文章页码：1407 - 1414
摘 要：Target assembly is a key consumable material for producing thin fi lm used in the electronic packaging and devices. The residual stresses induced during the process of soldering are detrimental to the performance of target assembly. In this work, the intensity and distribution of the soldering residual stress of Co/In/Cu target assembly subjected to a 20 W/(m~2 K) cooling condition corresponding to the actual air cooling process were studied, based on fi nite element simulation and Taguchi method, to optimize the sputtering target assembly. Effects of different control factors, including solder material, thickness of solder layer, target and backing plate, on the soldering residual stress of target assembly are investigated. The maximum residual stress is calculated as 9.28 MPa in the target located at 0.16 mm from target–solder layer interface and at a distance of 0.78 mm from symmetry axis. The optimal design in target assembly has the combination of indium solder material, cobalt target at 12 mm thick, solder layer at 0.8 mm thick, copper backing plate at 15 mm thick. Moreover, solder material is the most important factor among control factors in the target assembly.
Lin Jiang1,2，Liang Zhang1,3，Zhi-Quan Liu1,2
1. Institute of Metal Research , Chinese Academy of Sciences2. School of Materials Science and Engineering , University of Science and Technology of China3. School of Mechatronic Engineering , Jiangsu Normal University
摘 要：Target assembly is a key consumable material for producing thin fi lm used in the electronic packaging and devices. The residual stresses induced during the process of soldering are detrimental to the performance of target assembly. In this work, the intensity and distribution of the soldering residual stress of Co/In/Cu target assembly subjected to a 20 W/(m~2 K) cooling condition corresponding to the actual air cooling process were studied, based on fi nite element simulation and Taguchi method, to optimize the sputtering target assembly. Effects of different control factors, including solder material, thickness of solder layer, target and backing plate, on the soldering residual stress of target assembly are investigated. The maximum residual stress is calculated as 9.28 MPa in the target located at 0.16 mm from target–solder layer interface and at a distance of 0.78 mm from symmetry axis. The optimal design in target assembly has the combination of indium solder material, cobalt target at 12 mm thick, solder layer at 0.8 mm thick, copper backing plate at 15 mm thick. Moreover, solder material is the most important factor among control factors in the target assembly.
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