Research Progress in Solderable Black Pad of Electroless Nickel/Immersion Gold
来源期刊：JOURNAL OF RARE EARTHS2007年增刊第1期
论文作者：Bi Sifu Liu Haiping Li Deyu Li Ning
Key words：electroless nickel; immersion gold (ENIG); solderability failure; black pad;
Abstract: Electroless nickel/immersion gold (ENIG) technology is widely used as one of the surface final finish for electronics packaging substrate and printed circuit board (PCB), providing a protective, conductive and solderable surface. However, there is a solder joint interfacial brittle fracture (or solderability failure) of using the ENIG coating. The characteristics and the application of ENIG technology were narrated in this paper. The research progress on the solderability failure of ENIG was introduced. The mechanism of "black pad" and the possible measure of eliminating or alleviating the "black pad" were also introduced. The development direction and market prospects of ENIG were prospected.
Bi Sifu1，Liu Haiping1，Li Deyu1，Li Ning1
(1.Department of Applied Chemistry, Harbin Institute of Technology, Harbin 150001, China)
Abstract:Electroless nickel/immersion gold (ENIG) technology is widely used as one of the surface final finish for electronics packaging substrate and printed circuit board (PCB), providing a protective, conductive and solderable surface. However, there is a solder joint interfacial brittle fracture (or solderability failure) of using the ENIG coating. The characteristics and the application of ENIG technology were narrated in this paper. The research progress on the solderability failure of ENIG was introduced. The mechanism of "black pad" and the possible measure of eliminating or alleviating the "black pad" were also introduced. The development direction and market prospects of ENIG were prospected.
Key words:electroless nickel; immersion gold (ENIG); solderability failure; black pad;
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