轧制单层和少层晶铜箔塑性各向异性的晶体塑性有限元模拟

来源期刊:中国有色金属学报2021年第2期

论文作者:陈守东 卢日环 孙建 李杰

文章页码:353 - 365

关键词:单层晶;少层晶;极薄带轧制;晶体塑性;各向异性

Key words:single layer-crystal; oligo-crystal; foil rolling; crystal plasticity; anisotropy

摘    要:采用具有拉拔-压缩-剪切复合成形功能的微型异步轧机,对厚度方向具有单层和少层晶结构的铜极薄带开展箔轧实验。基于晶体塑性有限元理论,模拟分析复合轧制单层和少层晶铜极薄带的塑性各向异性行为。将单层和少层晶铜极薄带的初始织构和晶粒形貌输入晶体塑性有限元模型,分析极薄带轧制成形中晶粒层次的滑移启动、定量应变演化以及变形局部化现象。同时,模拟分析单/多滑移系启动、滑移局部化以及与微观组织相关的变形演化。结果表明:轧制单层晶铜极薄带的滑移区域和局部化趋势主要依赖于晶粒形貌结构,晶体塑性有限元模型准确获得滑移启动及其滑移区域的演化。轧制少层晶铜极薄带的滑移和塑性变形具有明显的各向异性,且随晶粒层数的减少而增强。同一晶粒内部和相邻晶粒的晶界局部区域存在显著的滑移与变形差异,这为裂纹的萌生和缺陷的形成提供了有利的位置。

Abstract: The single layer and oligo-crystal copper were studied using foil rolling under the compound forming with tension, compression and shearing. The plastic anisotropy of single layer and oligo-crystal copper under foil rolling was characterized by meso-scale crystal plasticity-finite element (CPFE) simulations. The single layer and oligo-crystal copper initial texture, grain morphology (microstructures) were incorporated into crystal plasticity finite element models. The grain-by-grain comparisons of slip activation, quantify the developing strain fields and the deformation localization can be carried out to analyze the foil rolling forming process. The single and multiple slip activation, slip localization and microstructure-sensitive deformation evolution were examined. The slip fields and localization of single layer-crystal copper under foil rolling depending on crystallographic structure. Modelling correctly captures slip activation and the developing slip fields. The slip and plastic deformation of oligo-crystal copper under foil rolling are markedly anisotropy, with the grain layer decreases driving strong variations, also reasonably captured by the model. The remarkable variations occur in grain and between locations either side of grain boundaries, providing appropriate opportunities for crack nucleation.

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