Wetting Behavior and Interfacial Reactions in （Sn-9Zn）-2Cu/Ni Joints during Soldering and Isothermal Aging

Ning Zhao, Haitao Ma, Haiping Xie and Lai Wang School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China

摘 要：The wetting property of （Sn-9Zn）-2Cu （wt pct） on Ni substrate and the evolution of interfacial microstructure in （Sn-9Zn）-2Cu/Ni joints during soldering as well as isothermal aging were studied. The wetting ability of eutectic Sn-9Zn solder on Ni substrate was markedly improved by adding 2 wt pct Cu into this solder alloy. Plate-like Cu5Zn8 intermetallic compounds （IMCs） were detected in （Sn-9Zn）-2Cu solder matrix. A continuous Ni5Zn21 IMC layer was formed at （Sn-9Zn）-2Cu/Ni interface after soldering. This IMC layer kept its type and integrality even after aging at 170?C for up to 1000 h. At the early aging stage （before 500 h）, the IMC layer grew fast and its thickness followed a linear relationship with the square root of aging time. Thereafter, however, the thickness increased very slowly with longer aging time. When the joints were aged for 1000 h, a new IMC phase, （Cu,Ni）5Zn8, was found in the matrix near the interface. The formation of （Cu,Ni）5Zn8 phase can be attributed to the diflusion of Ni atoms into the solder matrix from the substrate.

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