THE INFLUENCES OF SOLUTION PH AND CURRENT DENSITY ON COERCIVITY OF ELECTROPLATING CoNdNiMnP PERMANENT MAGNETIC ALLOY FILM ARRAYS
来源期刊：Acta Metallurgica Sinica2004年第5期
论文作者：B.Peng H.C.Jiang J.P.Zhang W.L.Zhang W.X.Zhang S.Q.Yang
Key words：solution PH; current density; electroplating; CoNdNiMnP film arrays; coercivity;
Abstract: The influences of plating bath solution PH and current density on coercivity of electroplating CoNdNiMnP permanent magnetic film arrays were studied. The experiment results show that both for solution PH and current density there were the best depositing parameters. Too high and too low plating bath solution PH or current density both result in decreasing of the film array coercivity. When solution PH is 3.5 and current density is 5mA/cm2, the prepared film array coercivity can reach the maximum.
B.Peng1，H.C.Jiang1，J.P.Zhang1，W.L.Zhang1，W.X.Zhang1，S.Q.Yang1
(1.School of Microelectronics and Solid Electronics, University of Electronic Science and Technology of China,Chengdu 610054, China)
Abstract:The influences of plating bath solution PH and current density on coercivity of electroplating CoNdNiMnP permanent magnetic film arrays were studied. The experiment results show that both for solution PH and current density there were the best depositing parameters. Too high and too low plating bath solution PH or current density both result in decreasing of the film array coercivity. When solution PH is 3.5 and current density is 5mA/cm2, the prepared film array coercivity can reach the maximum.
Key words:solution PH; current density; electroplating; CoNdNiMnP film arrays; coercivity;
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