Thickness of compound layer in steel-aluminum solid to liquid bonding

Peng Zhang, Yunhui Du, Hanwu Liu, Shuming Xing, Daben Zeng, Jianzhong Cui, and Limin Ba1)Department of Mechanical Engineering, Northern Jiaotong University, Beijing 100044, China2)Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China3)Metal Forming Department, Northeastern University, Shenyang 110006, China4)Anshan Automobile Fittings Factory, Anshan 114014, China

摘 要：<正> The bonding of solid steel plate to liquid aluminum was studied using rapid solidification. The surface of solid steel plate was defatted, descaled, immersed （in K2ZrF6 flux aqueous solution） and stoved. In order to determine the thickness of Fe-AI compound layer at the interface of steel-aluminum solid to liquid bonding under rapid solidification, the interface of bonding plate was investigated by SEM （Scanning Electron Microscope） experiment. The relationship between bonding parameters （such as preheat temperature of steel plate, temperature of aluminum liquid and bonding time） and thickness of Fe-AI compound layer at the interface was established by artificial neural networks （ANN） perfectly. The maximum of relative error between the output and the desired output of the ANN is only 5.4%. From the bonding parameters for the largest interfacial shear strength of bonding plate （226℃for preheat temperature of steel plate, 723℃ for temperature of aluminum liquid and 15.8 s for bonding time）, the reasona

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