Characterization of Cu3P phase in Sn3.0Ag0.5Cu0.5P/Cu solder joints
来源期刊：International Journal of Minerals Metallurgy and Materials2014年第1期
论文作者：Jian-xun Chen Xing-ke Zhao Xu-chen Zou Ji-hua Huang Hai-chun Hu Hai-lian Luo
文章页码：65 - 70
摘 要：This article reports the effects of phosphorus addition on the melting behavior,microstructure,and mechanical properties of Sn3.0Ag0.5Cu solder.The melting behavior of the solder alloys was determined by differential scanning calorimetry.The interfacial microstructure and phase composition of solder/Cu joints were studied by scanning electron microscopy and energy dispersive spectrometry.Thermodynamics of Cu-P phase formation at the interface between Sn3.0Ag0.5Cu0.5P solder and the Cu substrate was characterized.The results indicate that P addition into Sn3.0Ag0.5Cu solder can change the microstructure and cause the appearance of rod-like Cu3P phase which is distributed randomly in the solder bulk.The Sn3.0Ag0.5Cu0.5P joint shows a mixture of ductile and brittle fracture after shear testing.Meanwhile,the solidus temperature of Sn3.0Ag0.5Cu solder is slightly enhanced with P addition.
Jian-xun Chen，Xing-ke Zhao，Xu-chen Zou，Ji-hua Huang，Hai-chun Hu，Hai-lian Luo
School of Materials Science and Engineering,University of Science and Technology Beijing
摘 要：This article reports the effects of phosphorus addition on the melting behavior,microstructure,and mechanical properties of Sn3.0Ag0.5Cu solder.The melting behavior of the solder alloys was determined by differential scanning calorimetry.The interfacial microstructure and phase composition of solder/Cu joints were studied by scanning electron microscopy and energy dispersive spectrometry.Thermodynamics of Cu-P phase formation at the interface between Sn3.0Ag0.5Cu0.5P solder and the Cu substrate was characterized.The results indicate that P addition into Sn3.0Ag0.5Cu solder can change the microstructure and cause the appearance of rod-like Cu3P phase which is distributed randomly in the solder bulk.The Sn3.0Ag0.5Cu0.5P joint shows a mixture of ductile and brittle fracture after shear testing.Meanwhile,the solidus temperature of Sn3.0Ag0.5Cu solder is slightly enhanced with P addition.
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