Fabrication of W@Cu Composite Powders by Direct Electroless Plating Using a Dripping Method
来源期刊：Journal Of Wuhan University Of Technology Materials Science Edition2013年第4期
论文作者：刘树龙 YU Kan 沈强 LI Meijuan CHEN Wenshu LUO Guoqiang ZHANG Lianmeng
文章页码：829 - 833
摘 要：A direct electroless copper (Cu) coating on tungsten powders method requiring no surface treatment or stabilizing agent and using glyoxylic acid (C2H2O3) as a reducing agent was reported. The effects of copper sulfate concentration and the pH of the plating solution on the properties of the prepared W@Cu composite powders were assessed. The content of Cu in the composite powders was controlled by adjusting the concentration of copper sulfate in the electroless plating solution. A uniform, dense, and consistent Cu coating was obtained under the established optimum conditions (flow rate of C2H2O3 = 5.01 mL/min, solution pH = 12.25 and reaction temperature 45.35 ℃) by using central composite design method. In addition, the crystalline Cu coating was evenly dispersed within the W@Cu composite powders and Cu element in the coating existed as Cu0. The formation mechanism for the W@Cu composite powders by electroless plating in the absence of surface treatment and stabilizing agent was also proposed.
刘树龙1,2，YU Kan1，沈强1，LI Meijuan1，CHEN Wenshu1，LUO Guoqiang1，ZHANG Lianmeng1
1. Sate Key Laboratory of Advanced Technology for Material Synthesis and Processing, Wuhan University of Technology2. Department of Physics, Huaibei Normal University
摘 要：A direct electroless copper (Cu) coating on tungsten powders method requiring no surface treatment or stabilizing agent and using glyoxylic acid (C2H2O3) as a reducing agent was reported. The effects of copper sulfate concentration and the pH of the plating solution on the properties of the prepared W@Cu composite powders were assessed. The content of Cu in the composite powders was controlled by adjusting the concentration of copper sulfate in the electroless plating solution. A uniform, dense, and consistent Cu coating was obtained under the established optimum conditions (flow rate of C2H2O3 = 5.01 mL/min, solution pH = 12.25 and reaction temperature 45.35 ℃) by using central composite design method. In addition, the crystalline Cu coating was evenly dispersed within the W@Cu composite powders and Cu element in the coating existed as Cu0. The formation mechanism for the W@Cu composite powders by electroless plating in the absence of surface treatment and stabilizing agent was also proposed.
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