Influence of electroless Sn/Bi on Sn/Pb soldered joint strength

来源期刊：中国有色金属学报(英文版)2005年第z3期

论文作者：禹胜林 朱小军 严伟

文章页码：349 - 352

Key words：electroless layer； soldered joint； Sn/Pb； Sn/Bi； shear strength

Abstract: The solder joint strength of Pb/Sn soldering aluminum with electroless layer Sn/Bi and Cu was studied. The results show that the joint shear strength of electroless Sn/Bi on aluminum surface is lower than that of Cu. A Pb-riched region with porosity is formed in region of soldering fillet with electroless Sn/Bi. Both the electroless Sn/Bi layer and Pb-riched layer become thicker, which are the reasons why the shear strength of the solder joint with electroless Sn/Bi on aluminum surface is lower than that of electroless Cu, and the higher the thickness of the electroless Sn/Bi layer is, the lower the shear strength of solder joint is.