陶瓷与金属的氧化物封接料制备及其封接工艺
来源期刊：中南大学学报(自然科学版)1997年第2期
论文作者：曹建 刘雄飞 韦钦
文章页码：68 - 70
关键词：陶瓷； 金属； 封接界面
Key words：ceramic； metal； bonding interface
摘 要：用混合熔烧的方法，制备出一种氧化物 封接料．该封接料能在700℃下对氧化铝瓷与铜及铜合金进行气密性封接．在封接中，只需将封接料涂在陶瓷体的封接面，套上金属件，在马弗炉中以 5℃/min升温到700℃后保温10miN即可．对封接体所作的拉伸强度和气密性质量检测表明，封接界面的抗拉强度高于陶瓷本体强度，界面对空气的漏率 小于1．4×10-9Pa·m3/h，满足工业部门对封接质量的要求．
Abstract: A bonding material for brazing ceramic to metal was prepared and the corresponding bonding technology were developed. The examination for the properties of the interface between ceramic and metal showed that the tensile strength of the joint is higher than that of ceramics and the leaking rate to air on the joint is less than 1 4×10 -9 Pa·m3/h. This technology can be used in a wide variety of industries to form a hermetic ceramic metal jointing.
