Effect of constraint on crack propagation behavior in BGA soldered joints

来源期刊：中国有色金属学报(英文版)2001年第6期

论文作者：王莉 王国忠 方洪渊 钱乙余

文章页码：895 - 899

Key words：constraint; crack; behavior; joints

Abstract: The effects of stress triaxiality on crack propagation behavior in the BGA soldered joint were analyzed using FEM method. The computation results verified that stress triaxiality factor has an important effect on crack growth behavior. Crack growth rate increased with increasing stress triaxiality at the near-tip region, which is caused by increasing crack lengths or decreasing solder joint heights. Solder joint deformation is subjected to constraint effect provided by its surrounding rigid ceramic substrate, the constraint can be scaled by stress triaxiality near crack tip region. Therefore, it can be concluded that crack growth rate increased when the constraint effect increases.