Effects of cerium on Sn-Ag-Cu alloys based on finite element simulation and experiments
来源期刊：Journal of Rare Earths2009年第1期
论文作者：张亮 薛松柏 陈燕 韩宗杰 王俭辛 禹胜林 卢方焱
文章页码：138 - 144
摘 要：Effect of small addition of rare earth on Sn-Ag-Cu solder was investigated by finite element method based on creep model of low stress and high stress and experiments respectively.It was found that addition of rare earths evidently improved the resistance to creep deformation of the solder, so that the reliability of Sn-Ag-Cu-Ce solder joint could be improved remarkably.Mechanical testing and microstructural analysis results showed that, mechanical properties of alloys bearing Ce were better than that of the original alloy, and the optimum content of Ce was about 0.03wt.%.After aging intermetallic compound between solder joint and Cu substrate was observed and analyzed by X-ray diffraction（XRD）, scanning electron micrographs（SEM） and energy dispersive X-ray fluorescence spectrometer（EDX）.Results showed that the thickness of intermetallic compound layer would became thinner when the addition of Ce was about 0.03wt.%, and the grains of intermetallic compound became finer, and the microstructure was more homogeneous than that in the original Sn-Ag-Cu/Cu interface.
张亮1，薛松柏1，陈燕2，韩宗杰1，王俭辛1，禹胜林1,3，卢方焱1
1. College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics2. Harbin Welding Institute3. The 14th Research Institute, China Electronics Technology Group Corporation
摘 要：Effect of small addition of rare earth on Sn-Ag-Cu solder was investigated by finite element method based on creep model of low stress and high stress and experiments respectively.It was found that addition of rare earths evidently improved the resistance to creep deformation of the solder, so that the reliability of Sn-Ag-Cu-Ce solder joint could be improved remarkably.Mechanical testing and microstructural analysis results showed that, mechanical properties of alloys bearing Ce were better than that of the original alloy, and the optimum content of Ce was about 0.03wt.%.After aging intermetallic compound between solder joint and Cu substrate was observed and analyzed by X-ray diffraction（XRD）, scanning electron micrographs（SEM） and energy dispersive X-ray fluorescence spectrometer（EDX）.Results showed that the thickness of intermetallic compound layer would became thinner when the addition of Ce was about 0.03wt.%, and the grains of intermetallic compound became finer, and the microstructure was more homogeneous than that in the original Sn-Ag-Cu/Cu interface.
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