Oxidized film on C_p/Cu-Cd electrical contact material

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ÎÄÕÂÒ³Â룺251 - 255

Key words£ºCu-based composites£» electrical contact materials£» XPS£» oxidation

Abstract: Constituents of the oxidized surface film on diamond particles reinforced Cu-Cd alloy matrix composite £¨C_p/Cu-Cd£© were investigated by XPS. The results show that Cu₂O is the main constituent when the oxidized film is thin; CuO appears only after the film is rather thick. The originally formed oxidized film on the C_p/Cu-Cd is about 10¤@nm in thickness and is mainly composed of Cu₂O and Cu. After oxidized at 120¤@¡æ over 30¤@h, CuO is detected in the film.