混杂2D-C/Al电子封装复合材料的设计与制备

来源期刊：中国有色金属学报2000年第z1期

论文作者：于家康 周尧和

文章页码：1 - 5

关键词：电子封装材料； 功能复合材料； 熔体浸渗

Key words：electronic packaging materials； functional composites； melt infiltration

摘    要：设计了混杂C/SiC_p预制型中碳化硅颗粒的尺寸及体积分数 ,并用低压浸渗技术制备了非润湿体系混杂2D-C/Al电子封装复合材料。理论计算表明 :加入0.5%～2 % (体积分数 ,下同 )、尺寸 3～5μm的SiC_p可实现调节纤维体积分数范围为30%～60 % ,加入体积分数10%、尺寸15μm的SiC_p可将纤维体积分数调小到10 %。控制预制型中SiC_p的分布可获得纤维分布均匀的混杂 2D-C/Al复合材料。低压浸渗法制备混杂 2D-C/Al复合材料的热物理和拉伸性能优于高压法。

Abstract: The size and volume fraction of silicon carbide particle in hybrid C/SiC_p per-form were designed, and hybrid 2D-C/Al electronic packaging composites of non-wetting system were fabricated by low pressure infiltration. Theoretical calculation shows that the SiC_p with volume fraction of 0.5%～2% and size of 3～5μm can adjust volume fraction of carbon fibers from 30%～60%, and the SiC_p with volume fraction of 10% and size of 15 μm can decrease the volume fraction of carbon fibers to 10%. The hybrid 2D-C/Al composites with uniform distribution of carbon fibers were obtained by controlling the distribution of SiC_p in the hybrid per-form. The thermophysical and tensile properties of hybrid 2D-C/Al composites fabricated by low pressure infiltration are better than that by high pressure methods.