Microstructure and properties of Si_p/4032Al composite

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ÂÛÎÄ×÷ÕߣºÐÞ×ÓÑï ÕÅÇ¿ ËÎÃÀ»Û ÖìµÂÖ¾ Îä¸ß»Ô

ÎÄÕÂÒ³Â룺115 - 119

Key words£ºaluminum matrix composite£» microstructure£» thermal expansion£» thermal conductivity£» mechanical properties

Abstract: The environmental-friendly Si_p/4032Al composite with high content of silicon particles (65%, mass fraction) was fabricated by squeeze-casting method. The results show that the composite is dense and silicon particles are distributed uniformly. Transmission electron microscope observations show that a high density of stacking faults, twins and dislocations are found in silicon particles. The Si-Al interfaces are well-bonded and no interface reactants are found. The dislocations and eutectic silicon precipitates are observed in 4032Al matrix. The Si_p/4032Al composite has low density (2.4¤@g/cm³), low coefficient of thermal expansion (8.1¡Á10 ^-6/¡æ), high thermal conductivity (161.3¤@W/(m¡¤¡æ)), and the annealing treatment can reduce the coefficient of thermal expansion and improve the thermal conductivity. Moreover, the composite has excellent special strength(131.8¤@MPa¡¤cm³/g)and special modulus (49.7¤@GPa¡¤cm³/g).

»ù½ðÐÅÏ¢£ºthe Hi-tech Research and Development Program of China
the Key-tech Research and Development Program of Harbin, China