Microstructure and properties of liquid film solution-diffusion welding interface for ZCuBe2.5 Alloy

来源期刊：中国有色金属学报(英文版)2004年第3期

论文作者：徐锦锋 翟秋亚 钱翰城

文章页码：451 - 455

Key words：liquid film solution-diffusion welding; Cu-based alloy powder; ZCuBe2.5; microstructure; properties

Abstract: The microstructures and properties of liquid film solution-diffusion welding interface for ZCuBe2.5 alloy have been studied using Cu-base powder. It reveals that the welding joint has high tensile strength up to 278 MPa, rational distribution of hardness and better matches with base materials in properties. Weld metal consists of the uniform and fineαCu equiaxed grain and intergranular Cu_5.6Sn phase. The weld is well combined with base materials. The transition solid solution combination interface with a thickness of 150μm has been formed. In the process of stable welding, the thickness of interface appears to have an increase linearly with bonding time. In the cases of same bonding time, the thickness of interface increases with an increase of temperature gradient, which will become even more apparent with the increase of bonding time.