简介概要

Rheological Behavior and Process Prediction of Low Viscosity Epoxy Resin for RTM

来源期刊:Journal Of Wuhan University Of Technology Materials Science Edition2014年第5期

论文作者:周洲 蒋炳炎 CHEN Xingkai JIANG Fengze JIAN Yuping

文章页码:1078 - 1082

摘    要:The rheological behavior of a low epoxy resin system-SR8100/SD8734 for RTM in aviation industry was studied with viscosity experiments. The dual-Arrhenius rheological model and the improved engineering viscosity model were introduced and compared with the experimental data. The results indicated that the viscosity in the earlier stage calculated by dual-Arrhenius model matched the experimental data. As rising to 400 m·Pas, the viscosity calculated by the improved engineering model was closer to the experimental data. The processing windows of the resin system for RTM were determined by combining the two models, which could predict the rheological behavior of the resin system in a more credible way. 30-45 ℃ was the optimum processing temperature.

详情信息展示

Rheological Behavior and Process Prediction of Low Viscosity Epoxy Resin for RTM

周洲1,蒋炳炎1,2,CHEN Xingkai2,JIANG Fengze1,JIAN Yuping2

1. School of Mechanical and Electrical Engineering, The State Key Laboratory of High Performance and Complex Manufacturing, Central South University2. School of Aeronautics and Astronautics, Central South University

摘 要:The rheological behavior of a low epoxy resin system-SR8100/SD8734 for RTM in aviation industry was studied with viscosity experiments. The dual-Arrhenius rheological model and the improved engineering viscosity model were introduced and compared with the experimental data. The results indicated that the viscosity in the earlier stage calculated by dual-Arrhenius model matched the experimental data. As rising to 400 m·Pas, the viscosity calculated by the improved engineering model was closer to the experimental data. The processing windows of the resin system for RTM were determined by combining the two models, which could predict the rheological behavior of the resin system in a more credible way. 30-45 ℃ was the optimum processing temperature.

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