表面组装焊点内部应力—应变场的数值模拟(Ⅱ)——焊点失效的主控力学因素
来源期刊：中国有色金属学报2000年第3期
论文作者：钱乙余 马鑫 吉田综仁
文章页码：411 - 415
关键词：相对损伤应力； 主控力学因素； 空洞损伤；温度历史
Key words：relative damage stress； dominant mechanical factor； void damage； temperature history
摘 要：温度循环载荷可以在焊点界面处形成足以导致空洞损伤发生的高应力三轴度。 针对温度循环载荷下软钎焊焊点界面空洞损伤的失效行为特点，结合焊点内部应力—应变场分布特征及其温度历史相关性， 提出了相对损伤应力这一概念，并以此作为温度循环载荷下软钎焊焊点失效的主控力学因素。分析了温度历史不同阶段对焊点失效行为的影响，结果表明高温保温阶段焊点内部最容易发生空洞损伤。
Abstract: Interface void damage is the failure characteristic of solder joint under temperature cycling. Based on the distribution feature and temperature history relativity of stressstrain field in the solder joint, the concept of relative damage stress was put forward as dominant mechanical factor responsible for the failure of solder joint. Analysis results showed that it is easiest for void damage to occur in the high temperature holding time during temperature cycling history.
