Deformation efficiency, homogeneity, and electrical resistivity of pure copper processed by constrained groove pressing
来源期刊：Rare Metals2014年第3期
论文作者：Zong-Shen Wang Yan-Jin Guan Ping Liang
文章页码：287 - 292
摘 要：Constrained groove pressing（CGP） is a new severe plastic deformation method suitable for producing ultra-fine grained sheet metals. In this work, the processing efficiency for a muti-pass CGP of pure copper was investigated. With a relatively small groove width of 2 mm and tight constraint, a sharp variation of mechanical properties with pass number is observed. Subgrains with the size of*0.5 lm have distinct boundaries, which is the predominant feature in the microstructure after three passes. The evolution of deformation homogeneity characterized by micro-hardness distribution was examined in detail.Observations of optical micrographs and fracture surface morphology confirm the evolution rule. The relation between electrical resistivity and accumulative plastic strain was discussed. Crystalline defects, micro-cracks, and microstructure uniformity together determine the change of electrical resistivity of CGP copper.
Zong-Shen Wang，Yan-Jin Guan，Ping Liang
Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), Shandong University
摘 要：Constrained groove pressing（CGP） is a new severe plastic deformation method suitable for producing ultra-fine grained sheet metals. In this work, the processing efficiency for a muti-pass CGP of pure copper was investigated. With a relatively small groove width of 2 mm and tight constraint, a sharp variation of mechanical properties with pass number is observed. Subgrains with the size of*0.5 lm have distinct boundaries, which is the predominant feature in the microstructure after three passes. The evolution of deformation homogeneity characterized by micro-hardness distribution was examined in detail.Observations of optical micrographs and fracture surface morphology confirm the evolution rule. The relation between electrical resistivity and accumulative plastic strain was discussed. Crystalline defects, micro-cracks, and microstructure uniformity together determine the change of electrical resistivity of CGP copper.
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