An Easy Way to Quantify the Adhesion Energy of Nanostructured Cu/X(X=Cr,Ta,Mo,Nb,Zr) Multilayer Films Adherent to Polyimide Substrates
来源期刊：Acta Metallurgica Sinica2016年第2期
论文作者：Kai Wu Jin-Yu Zhang Gang Liu Jiao Li Guo-Jun Zhang Jun Sun
文章页码：181 - 187
摘 要：An approach based on film buckling under simple uniaxial tensile testing was utilized in this paper to quantitatively estimate the interfacial energy of the nanostructured multilayer films（NMFs） adherent to flexible substrates. The interfacial energies of polyimide-supported NMFs are determined to be *5.0 J/m2 for Cu/Cr, *4.1 J/m2 for Cu/Ta,*2.8 J/m2 for Cu/Mo, *1.1 J/m2 for Cu/Nb, and *1.2 J/m2 for Cu/Zr NMFs. Furthermore, a linear relationship between the adhesion energy and the interfacial shear strength is clearly demonstrated for the Cu-based NMFs, which is highly indicative of the applicability and reliability of the modified models.
Kai Wu1，Jin-Yu Zhang1，Gang Liu1，Jiao Li1，Guo-Jun Zhang2，Jun Sun1
1. State Key Laboratory for Mechanical Behavior of Materials,Xi’an Jiaotong University2. School of Materials Science and Engineering, Xi’an University of Technology
摘 要：An approach based on film buckling under simple uniaxial tensile testing was utilized in this paper to quantitatively estimate the interfacial energy of the nanostructured multilayer films（NMFs） adherent to flexible substrates. The interfacial energies of polyimide-supported NMFs are determined to be *5.0 J/m2 for Cu/Cr, *4.1 J/m2 for Cu/Ta,*2.8 J/m2 for Cu/Mo, *1.1 J/m2 for Cu/Nb, and *1.2 J/m2 for Cu/Zr NMFs. Furthermore, a linear relationship between the adhesion energy and the interfacial shear strength is clearly demonstrated for the Cu-based NMFs, which is highly indicative of the applicability and reliability of the modified models.
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