Electrodeposition behavior of nanocrystalline CoNiFe soft magnetic thin film

来源期刊:中国有色金属学报(英文版)2006年第3期

论文作者:李劲风 张昭 阴军英 俞耿华 蔡超 张鉴清

文章页码:659 - 665

Key words:nanocrystalline CoNiFe film; soft magnetism; pulse-reverse electroplating; anomalous co-deposition; electrocrystalliza- tion mechanism

Abstract: The electroplating behavior of nanocrystalline CoNiFe soft magnetic thin film with high saturation magnetic flux density (Bs>2.1 T) and low coercivity (Hc) was investigated using cyclic voltammetry and chronoamperometry methods in conjunction with the scanning electron microscopy (SEM/EDX). The results show that, under the experimental conditions, the co-deposition of CoNiFe film behaves anomalously due to the atomic radii of iron series elements following the order of rFe>rCo>rNi. In the case of lower electroplating current density, the co-deposition of CoNiFe film follows a 3-D progressive nucleation/growth mechanism, while in the case of higher electroplating current density, which follows a 3-D instantaneous nucleation/growth mechanism. Meanwhile, the change of nucleation mechanism of CoNiFe film with electroplating current density was interpreted theoretically in the light of quantum chemistry.

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