Bi对Sn-Zn基无铅钎料合金组织与性能的影响

来源期刊：有色金属2010年第4期

论文作者：陈伟 胡强 张富文

文章页码：4 - 8

关键词：金属材料； Sn-Zn-Bi钎料； 润湿性； 组织； 熔点

Key words：metal material； Sn-Zn-Bi solder； wetting property； microstructures； melting point

摘    要：在Sn-(5~9)Zn二元钎料合金中加入1%~3%的Bi,研究Sn-Zn-Bi三元钎料合金的组织、熔化特性及润湿性。在Sn-Zn二元钎料合金结晶过程中,Sn-(5~7)Zn二元钎料合金形成富β-Sn的初生相,随着Zn量的增加,Sn-Zn二元钎料合金形成富Zn的初生相。添加Bi明显改善了钎料合金的润湿性能,当Bi添加量为3%时改善效果最好。另外,对钎料合金进行差热分析发现少量Bi的添加对Sn-Zn系钎料合金的熔点和熔程没有明显的影响。

Abstract: Bi is added into Sn-(5~9)Zn alloys with 1%~3%.and the microstructures,melting behaviors and wetting properties of Sn-Zn-Bi system alloy are investigated.The results show that the primary β-Sn rich phase appears in Sn-(5~7)Zn solder from the melts firstly on cooling.With addition of Zn,the primary Zn rich phase appears in the solders.The wettability of the solder is significantly improved by addition of Bi,and the best effect is achieved with 3% Bi content.In addition,there is no obvious influence on the melting points and the pasty ranges of the Sn-Zn solders by small amount addition of Bi.